By Dr. Markus Graf, Dr. Diego Barrettino, Prof. Dr. Henry P. Baltes, Prof. Dr. Andreas Hierlemann (auth.)
This is the 1st finished booklet on microhotplate-based chemical sensor structures in CMOS-technology. It covers all features of profitable sensor prototyping: idea of transducer modelling, microelectronics layout issues, approach layout matters, and concerns concerning approach and machine microfabrication, packaging, and checking out. numerous varied hotplates for various operation stipulations is designated and a kinfolk of metal-oxide-covered microhotplate-based microsensor platforms with expanding complexity is gifted. those platforms belong to a brand new iteration of chemical microsensors and symbolize examples of the winning integration of nanomaterials, microtechnology and microelectronics.
The booklet offers scholars, scientists and engineers with an available creation to the sector of microhotplate-based chemical sensing, with all of the invaluable basic wisdom integrated. past that, it additionally offers targeted details on all very important matters touching on advanced high-performance CMOS chemical microsensor platforms; consequently it is going to even be important to specialists already acquainted with the field.
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Extra resources for CMOS Hotplate Chemical Microsensors
Mixed-frequency deposition of the nitride is one possibility to adjust the stress in the deposited layer . kHz) plasma can be varied during the process. For the layer used here 95% high-frequency deposition time was chosen (Fig. The stress was measured on wafer-level with a thin-ﬁlm stress analyzer. The stress value was determined by recording the curvature of the wafer after thin-ﬁlm deposition. A tensile stress of MPa was measured for the layer. Fig. 15. 4 Microhotplate with MOS-Transistor Heater 49 After the deposition of the passivation, the contact electrodes for the resistive measurements have to be opened (Fig.
A homogeneous temperature distribution in the heated area is highly desirable to make sure that all sensing processes on the hotplate take place at the same deﬁned and precisely controlled temperature. – A high thermal resistance is needed to achieve minimum power consumption. V. In view of the above considerations, a circular design of the heated area (300 µm diameter) on a square dielectric membrane ( µm ) was chosen, which is shown in Fig. 1. 1. A considerable part of the heat is usually dissipated through the metal supply lines to the bulk.
The annealing temperature range can be extended up to C by using the hotplate annealing heater. 3 Physical Microhotplate Characterization For thermal characterization and temperature sensor calibration a microhotplate was fabricated, which is identical to that on the monolithic sensor chips, but does not include any electronics. The functional elements of this microhotplate are connected to bonding pads and not wired up to any circuitry, so that the direct access to the hotplate components without electronics interference is ensured.